Description: Applications that require placement forces below 150 grams of force. Placement forces as low as 20 grams can be accomplished. Applications where low force may be required: RF applications, Silicon on Silicon, other custom processes. The tips on low force nozzles are replaceable; this depends on the application. All we require is a min/max measure of force required for placement and a description or data sheet for the components to be placed.

Offered but not limited to: All Styles of Delicate components, including flip chips and dies.

Price: $1,687.50 (OEM Price $2,250) Software sold seperately.

Components:

• Gaas die, Galium Arsenide
• Thin Silicon, less than .010” in thickness
• Die with air bridges
• Flip Chips
  

Capabilities: Universal GSM Flex Head Inline 4-spindle high force or pressure enhanced placement head.

OEM Reference Numbers: 47838121, 47038121

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